MAUI, the United States, Dec. 3 (Xinhua) -- U.S. leading chip manufacturer Qualcomm unveiled two new 5G Snapdragon mobile platforms at its annual tech summit that opened in Maui, Hawaii on Tuesday.
Alex Katouzian, senior vice president and general manager of the Mobile Business Unit at Qualcomm Technologies, Inc., introduced the two new platforms to hundreds of participants.
The Snapdragon 865 Mobile Platform, which includes the Snapdragon X55 Modem-RF System, is a global 5G platform designed to deliver unmatched connectivity and performance for the next generation of devices, he said.
And the Snapdragon 765/765G bring integrated 5G connectivity, Artificial Intelligence (AI) processing and select Qualcomm Snapdragon Elite Gaming experiences, Katouzian said.
At the summit, Qualcomm also announced modular 5G mobile platforms, and new 3D sonic fingerprint technology which allows for increased security via simultaneous two-finger authentication, increased speed and ease of use.
"5G will open new and exciting opportunities to connect, compute, and communicate in ways we've yet to imagine and we are happy to be a key player driving the adoption of 5G around the world," said Qualcomm President Cristiano Amon.
