Chinese company displays high-speed wireless communication technology at forum in San Francisco

Source: Xinhua| 2019-02-22 18:59:09|Editor: Liangyu
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SAN FRANCISCO, Feb. 21 (Xinhua) -- A Chinese company has showcased at a global forum here a high-speed wireless communication technology deployed in rail systems in some Chinese cities, a company senior executive said Thursday.

Yang Li, vice president of Nufront (Beijing) Technology Group Co., Ltd., said participants of the International Solid-State Circuits Conference 2019 (ISSCC 2019) showed great interest in the company's experience in applying its Ultra Reliable and Low Latency Communication (URLLC) wireless technology to China's railway systems.

ISSCC 2019 honored the company with the Technology Innovation Award for the World's First Deployed URLLC Wireless Communication System and Systems-on-a-Chip (SoC) during its five-day event that ended here Thursday.

Thousands of scholars, professionals, engineers and senior executives from businesses and industries attended the annual ISSCC global forum for presentation of advances in solid-state circuits and SoCs.

Yang said China is leading the world in developing high-speed railway networks, which topped 29,000 km by the end of 2018, accounting for more than two-thirds of the total high-speed railways across the globe.

He said his company's URLLC technology can offer reliable communication for railway service, including high-speed railway, urban metro systems and other sectors, because its Enhanced Ultra High Throughput (EUHT) wireless communication system can achieve super high reliability and end-to-end latency of 0.8 millisecond at a speed of 300 km per hour.

Such technological performance based on the third generation commercial EUHT SoCs has been demonstrated during the ISSCC 2019, he said.

Yang said the URLLC technology has been already adopted for railway and metro systems in the Chinese cities of Beijing, Tianjin and Guangzhou.

The ISSCC is held in this U.S. western coastal city every February and it is a global platform that showcases the world's most recent advances in solid-state circuits and SoCs.